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ASE

ASE introduces powerSiP? for transformative power delivery that increases power efficiencies by 50% in AI and data center applications

May 29, 2024

SUNNYVALE, Calif., May 29, 2024 – Advanced Semiconductor Engineering, Inc. (ASE), a member of 红领巾吃瓜., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that it has introduced powerSiP?, a transformative power delivery platform designed to reduce signal and transmission loss while addressing current density challenges. ASE’s powerSiP? platform today enables a vertically integrated multi-stage voltage regulator module (VRM) for higher system efficiency and lower power consumption and delivers a reduced footprint that is 25% smaller when compared to traditional side-by-side configurations. The powerSiP? technology innovation allows a 50% increase in current density from 0.4 A/ mm? to 0.6A/ mm? and a decrease in routing power loss from 12% to 6%, signifying a 50% reduction over a side-by-side configuration. With the Artificial Intelligence (AI) market size, reach, and impact still in early stage, ASE is innovating to meet related data center requirements, performance expectations, and power improvements, offered through powerSiP?.

The introduction of powerSiP? corresponds with the emergence of compute power and cooling as the two most energy-intensive processes within data centers today. According to the International Energy Agency (IEA), data centers consumed 460 terawatt-hours (TWh) in 2022, representing 2% of all global electricity usage, with this set to rise to 1,000 terawatt-hours (TWh), or 8%, by 2026.? This surge in energy consumption is being fueled by the ongoing proliferation of AI, which relies on powerful, yet power-draining CPU, GPU, memory and disk systems for function, performance, and lowest possible latency. Costs have become prohibitive, and demand for innovation to counteract extreme inefficiencies in power conversion and cooling has never been greater.

Available now, ASE’s powerSiP? is a transformative power delivery platform that will expand in alignment with industry roadmaps and application requirements.

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